Glenn Ibarreta is a notable inventor based in Ridgefield, WA (US). He has made significant contributions to the field of electroplating technology, holding a total of 2 patents. His work focuses on improving the uniformity and efficiency of metal layer plating on wafers.

Latest Patents

Ibarreta's latest patents include innovative methods and apparatuses for electroplating. The first patent describes an apparatus that features an ionically resistive ionically permeable element positioned close to the wafer surface. This design modulates ionic current at the wafer surface, allowing for the plating of uniform metal layers while mitigating the terminal effect. The second patent introduces a remotely positioned second cathode that enhances current density modulation during the electroplating process. This configuration improves the uniformity of plated layers by diverting current flow from the near-edge region of the wafer.

Career Highlights

Glenn Ibarreta is associated with Novellus Systems Incorporated, a company known for its advancements in semiconductor manufacturing technologies. His work has been instrumental in developing solutions that address challenges in the electroplating process.

Collaborations

Ibarreta has collaborated with notable colleagues, including Jonathan David Reid and Bryan L Buckalew. Their combined expertise has contributed to the innovative advancements in electroplating technology.

Conclusion

Glenn Ibarreta's contributions to electroplating technology demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the complexities involved in semiconductor manufacturing processes.