The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2010
Filed:
Aug. 16, 2006
Jonathan Reid, Sherwood, OR (US);
Seshasayee Varadarajan, Lake Oswego, OR (US);
Bryan Buckalew, Tualatin, OR (US);
Patrick Breiling, Portland, OR (US);
Glenn Ibarreta, Tualatin, WA (US);
Jonathan Reid, Sherwood, OR (US);
Seshasayee Varadarajan, Lake Oswego, OR (US);
Bryan Buckalew, Tualatin, OR (US);
Patrick Breiling, Portland, OR (US);
Glenn Ibarreta, Tualatin, WA (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
An apparatus for electroplating a layer of metal on the surface of a wafer includes a second cathode located remotely with respect to the wafer. The remotely positioned second cathode allows modulation of current density at the wafer surface during an entire electroplating process. The second cathode diverts a portion of current flow from the near-edge region of the wafer and improves the uniformity of plated layers. The remote position of second cathode allows the insulating shields disposed in the plating bath to shape the current profile experienced by the wafer, and therefore act as a 'virtual second cathode'. The second cathode may be positioned outside of the plating vessel and separated from it by a membrane.