Moca, Puerto Rico

Giovanny Soto Acevedo

This inventor holds 1 USPTO granted patent. Top assignee: Rtx Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Giovanny Soto Acevedo. Retrieved from https://idiyas.com/inventor/giovanny-soto-acevedo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Giovanny Soto Acevedo: Inventor of a Controlled-Thickness Repair Method

Introduction

Giovanny Soto Acevedo is an inventor associated with Moca, Puerto Rico, and RTX Corporation. His patent work addresses a repair technique for surfaces near filleted transitions.

Latest Patents

Acevedo is named on 1 patent: “Method and Apparatus for Controlled Thickness Patch Adjacent Filleted Surfaces.” The invention describes a method for applying repair material at a controlled thickness to a damaged surface next to a filleted surface between a case surface and a strut. A spacer is positioned on the case surface, and its outer surface establishes a predetermined drop height at the fillet. Repair material is then screeded with a straight edge positioned against the spacer and the strut, or a guide mask on the strut, to form the patch.

Career Highlights

Acevedo’s patent reflects work on a practical repair process designed to control material thickness around complex surface geometry. The available information identifies RTX Corporation as his company.

Collaborations

Sohail Mohammed and William Bogue are identified as Acevedo’s coworkers. The provided information does not specify their roles in the patent or whether they collaborated on the invention.

Conclusion

Giovanny Soto Acevedo’s patent documents a controlled-thickness repair approach for damaged surfaces near filleted structures, connecting his inventive work with RTX Corporation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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