The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Oct. 03, 2024
Applicant:

Rtx Corporation, Farmington, CT (US);

Inventors:

Sohail Mohammed, Manchester, CT (US);

William Bogue, Hebron, CT (US);

Austin Conrad Peters, Norman, OK (US);

Giovanny Soto Acevedo, Moca, PR;

Assignee:

RTX CORPORATION, Farmington, CT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F01D 5/00 (2006.01); B23P 6/00 (2006.01); B23P 6/04 (2006.01);
U.S. Cl.
CPC ...
F01D 5/005 (2013.01); B23P 6/002 (2013.01); B23P 6/007 (2013.01); B23P 6/045 (2013.01); F05D 2230/80 (2013.01); F05D 2300/611 (2013.01);
Abstract

A method and apparatus for applying a controlled thickness patch of repair material to a damaged surface adjacent a filleted surface disposed between a case surface and a strut is disclosed. A spacer is positioned on the case surface adjacent the filleted surface, with an outermost surface of the spacer dimensioned to intersect the filleted surface at a predetermined drop height from the case surface. Repair material is applied to the damaged surface by screeding with a straight edge. The straight edge is positioned with a first end against the outermost surface of the spacer and the filleted surface at the drop height, and a second end positioned against the strut or a guide mask disposed thereon so as to form a controlled thickness patch of repair material to the strut and filleted surface when the repair material is screeded.


Find Patent Forward Citations

Loading…