Company Filing History:
Years Active: 2017-2021
Title: **Giorgio Mariottini: Innovator in Semiconductor Technology**
Introduction
Giorgio Mariottini is a notable inventor based in Boise, ID, recognized for his contributions to semiconductor technology. With two patents to his name, he is making significant strides in innovations that enhance interconnect systems within the semiconductor industry.
Latest Patents
Giorgio's latest patents include designs for collars for under-bump metal (UBM) structures and associated systems and methods. This technology focuses on the manufacturing of collars that play a critical role in die-to-die and package-to-package interconnects. The innovation encompasses the integration of semiconductor materials embedded with solid-state components, where an under-bump metal structure is formed over the semiconductor material. This structure is electrically coupled to important interconnects, with a collar surrounding a portion of the UBM structure and solder material placed over the top surface, facilitating improved connectivity and reliability in semiconductor devices.
Career Highlights
Giorgio Mariottini works for Micron Technology Incorporated, a leading company in the semiconductor industry. His work focuses on cutting-edge innovations that push the boundaries of current technologies, helping to develop reliable and efficient interconnect solutions.
Collaborations
Throughout his career, Giorgio has collaborated with esteemed colleagues, including Sameer S. Vadhavkar and Wayne H. Huang. These collaborations have contributed to the advancement of technology and the development of patents that enhance the field of semiconductor manufacturing.
Conclusion
Giorgio Mariottini stands out as a prominent inventor in the semiconductor space, holding two patents that contribute significantly to the efficiency and reliability of interconnect systems. His work at Micron Technology Incorporated, along with collaborative efforts with respected colleagues, positions him as an essential figure in driving technological advancements in the industry.