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For the Inventor, By the Inventor

Sindelfingen, Germany

Gerhard H Ruehle

This inventor holds 15 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2001-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gerhard H Ruehle. Retrieved from https://idiyas.com/inventor/gerhard-h-ruehle

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15

% Patents Active = 46.7

Average Co-Inventor Count = 4.1

ph-index = 5

Forward Citations = 58(Granted Patents)


Location History:

  • Sommerhofenstrasse, DE (2001 - 2003)
  • Sommerhofenstrasse 67, DE (2003)
  • Sindelfingen, DE (2002 - 2015)

Company Filing History:

goldMedal15 out of 166,325 
 
International Business Machines Corporation
 patents

Years Active: 2001-2015

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15 patents (USPTO):Explore Patents
1. 8929086 - Gel package structural enhancement of compression system board connections (2015-01-06),
2. 7930820 - Method for structural enhancement of compression system board connections (2011-04-26),
3. 7543373 - Gel package structural enhancement of compression system board connections (2009-06-09),
4. 7344919 - Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener (2008-03-18),
5. 6669488 - Removable housing for mounting pin grid array (2003-12-30),
6. 6644983 - Contact assembly, connector assembly utilizing same, and electronic assembly (2003-11-11),
7. 6605953 - Method and apparatus of interconnecting with a system board (2003-08-12),
8. 6549024 - Method of interconnecting with a system board (2003-04-15),
9. 6538460 - Method and apparatus for enhancing a system board (2003-03-25),
10. 6529023 - Application and test methodology for use with compression land grid array connectors (2003-03-04),
11. 6462573 - System interface assembly and method (2002-10-08),
12. 6433562 - Method and apparatus of interconnecting with a system board (2002-08-13),
13. 6429644 - Method and apparatus of interconnecting with a system board (2002-08-06),
14. 6342788 - Probing systems for chilled environment (2002-01-29),
15. 6252391 - High frequency probe (2001-06-26),

Title: Gerhard H Ruehle: Innovator in Compression System Board Connections

Introduction

Gerhard H Ruehle is a prominent inventor based in Sindelfingen, Germany. He has made significant contributions to the field of computer systems, particularly in the area of multi-chip module (MCM) technology. With a total of 15 patents to his name, Ruehle's work has had a lasting impact on the design and functionality of large-scale computing systems.

Latest Patents

Ruehle's latest patents include innovative methods for enhancing the structural integrity and performance of compression system board connections. One notable patent describes a gel package structural enhancement that improves the mechanical, thermal, and electrical properties of MCM system boards. This design incorporates a Land Grid Array (LGA) compression connector, which is crucial for maintaining the efficiency of computer systems. The method addresses the gaps that can form between the MCM and the stiffening frame, promoting better thermal conduction and enhancing the electrical properties of the connections.

Career Highlights

Gerhard H Ruehle has spent a significant portion of his career at International Business Machines Corporation (IBM). His work has focused on developing advanced technologies that improve the performance and reliability of computing systems. Ruehle's innovative approaches have positioned him as a key figure in the evolution of MCM technology.

Collaborations

Ruehle has collaborated with notable colleagues, including Michael F McAllister and Klaus K Kempter. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Gerhard H Ruehle's contributions to the field of computer systems through his patents and collaborations have established him as a leading inventor in his domain. His innovative solutions continue to influence the design and functionality of modern computing technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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