The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Sep. 26, 2005
Applicants:

Michael F. Mcallister, New Milford, CT (US);

Harald Pross, Wildberg, DE;

Gerhard H. Ruehle, Sindelfingen, DE;

Wolfgang A. Scholz, Starzach, DE;

Gerhard Schoor, Dettenhausen, DE;

Inventors:

Michael F. McAllister, New Milford, CT (US);

Harald Pross, Wildberg, DE;

Gerhard H. Ruehle, Sindelfingen, DE;

Wolfgang A. Scholz, Starzach, DE;

Gerhard Schoor, Dettenhausen, DE;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 1/02 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 23/3737 (2013.01); H01L 24/72 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/14 (2013.01); H05K 3/0058 (2013.01); H05K 3/325 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/2009 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01043 (2013.01);
Abstract

A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.


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