Company Filing History:
Years Active: 2018-2023
Title: Innovations by Gerald Peter Beyer in Semiconductor Bonding
Introduction
Gerald Peter Beyer is a notable inventor based in Heverlee, Belgium. He has made significant contributions to the field of semiconductor technology, holding three patents that enhance the efficiency and effectiveness of semiconductor bonding processes.
Latest Patents
One of his latest patents is titled "Method of Direct Bonding Semiconductor Components." This patent describes a method for bonding semiconductor components through direct metal-metal bonds between metal bumps on one component and corresponding bumps or contact pads on another. The process includes establishing fast solidified solder connections and performing a heating step afterward to realize the metal-metal bonds. This innovative approach improves the throughput of the bonding process by allowing multiple dies to be bonded simultaneously, followed by a single heating step.
Another significant patent is "Method of Bonding Semiconductor Substrates." This technology focuses on integrating semiconductor dies by bonding substrates that include dielectric bonding layers made of silicon carbon oxide, silicon carbon nitride, or silicon carbide. The method involves pre-treating the dielectric bonding layers through plasma activation and wet surface treatment before bonding the substrates together. Post-bond annealing is also included in the process to enhance the assembly's integrity.
Career Highlights
Gerald Peter Beyer works at Imec Vzw, a leading research and innovation hub in nanoelectronics and digital technologies. His work at Imec has positioned him as a key player in advancing semiconductor technologies.
Collaborations
He collaborates with esteemed colleagues such as Eric Beyne and Lan Peng, contributing to the innovative environment at Imec.
Conclusion
Gerald Peter Beyer's contributions to semiconductor bonding methods reflect his expertise and commitment to innovation in the field. His patents not only enhance the efficiency of semiconductor processes but also pave the way for future advancements in technology.