Baulne, France

Georges Henri Robert


Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 207(Granted Patents)


Location History:

  • La Ferte-Alais, FR (1992)
  • Baulne, FR (1999 - 2002)

Company Filing History:


Years Active: 1992-2002

where 'Filed Patents' based on already Granted Patents

5 patents (USPTO):

Title: Georges Henri Robert of Baulne: Innovator and Collaborator in Low Temperature Solder Interconnections

Introduction:

Georges Henri Robert, hailing from Baulne, FR, is a renowned inventor and researcher in the field of low temperature solder interconnections. With an impressive track record of five patents, Robert's expertise lies in developing methods and structures for chip attachments that require lower temperatures. In this article, we will delve into his latest patents, career highlights, and notable collaborations.

Latest Patents:

One of Robert's recent patents is the "Method for forming reflowed solder ball with low melting point metal cap." This invention introduces a novel technique for creating smooth-surfaced solder balls, by first forming them through conventional means and then reflowing the solder to ensure a polished finish. Furthermore, Robert proposes depositing a layer of low melting point metal (like bismuth, indium, or tin) on the solder ball, enabling subsequent low temperature joining cycles. This approach eliminates the need for tinning the substrate, making it cost-effective. Additionally, the structure exhibits a liquid fillet formation around the joint with copper wires, improving thermal fatigue life and facilitating chip removal for burn-in, replacement, or repairs.

Career Highlights:

Georges Henri Robert's career has been marked by significant contributions to the development of low temperature solder interconnections. His expertise in finding innovative solutions has benefited the field immensely. Through his detailed research and experimentation, Robert has successfully enhanced the reliability and efficiency of chip attachments. His patents reflect his invaluable expertise and dedication to cutting-edge technological advancements.

Collaborations:

Throughout his career, Georges Henri Robert has actively collaborated with various individuals and organizations to further his research and bring about meaningful innovations. Notably, he has worked closely with esteemed colleagues such as Hormazdyar M Dalal and Gene J Gaudenzi. These collaborations have fostered a dynamic exchange of ideas and expertise, ultimately fueling new breakthroughs in the field.

Conclusion:

Georges Henri Robert's impact in the realm of low temperature solder interconnections cannot be understated. His latest patents highlight his commitment to developing cost-effective and reliable methods for chip attachments. Through his collaborations and career achievements, Robert has solidified his position as a pioneering inventor in the industry. His contributions continue to shape the landscape of innovations and patents in solder interconnections, opening avenues for further advancements.

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