International Business Machines Corporation

Georges Henri Robert

Hormazdyar M Dalal

Gene J Gaudenzi

Frederic Robert Pierre

Kenneth Michael Fallon

Alexis Bitaillou

Kenneth Robert Herman

Henri Lochon

A method and structure for a solder interconnection, using solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate is disclosed. After a solder ball has been formed using standard methods it is reflowed to give the solder ball a smooth surface. A layer of low melting point metal, such as, bismuth, indium or tin, preferably, pure tin, is deposited on the top of the solder balls. This structure results in localizing of the eutectic alloy, formed upon subsequent low temperature joining cycle, to the top of the high melting solder ball even after multiple low temperature reflow cycles. This method does not need tinning of the substrate to which the chip is to be joined, which makes this method economical. It has also been noticed that whenever temperature is raised slightly above the eutectic temperature, the structure always forms a liquid fillet around the joint with copper wires. This liquid fillet formation results in substantial thermal fatigue life improvement for reduced stress at interface; and secondly, provides an easy means to remove chip for the purpose of chip burn-in, replacement or field repairs.

Method for forming reflowed solder ball with low melting point metal cap

Reflowed solder ball with low melting point metal cap

A material deposition process is disclosed in which apertures of a contact mask used therein have a constricted opening terminating in a `knife edge` in a sidewall thereof near the top mask side, especially within the top 25% of the mask thickness above the substrate. A process is disclosed in which the mask, in addition, has apertures which have larger dimension lower openings on a bottom side of the mask contacting the substrate than constricted openings near the top side of the mask. Single solder bump and 'bump on bump' over BLM (ball limiting metallurgy) processes are disclosed which utilize such contact mask to reduce the damage and detaching of such features during processing and subsequent handling.

Method for forming features upon a substrate

A material deposition contact mask is disclosed in which apertures formed therein have a larger dimension in lower openings in a bottom side of the mask contacting the substrate than in constricted openings located near the top side of the mask. Apertures of the contact mask have knife edges located within the upper sidewalls thereof, e.g. within the top 25% of the mask thickness above the substrate. A mask is disclosed which, in addition, is thermally compensated to the substrate temperature at which the deposition is performed. Methods for fabricating the mask by differential etching are disclosed.

Selective deposition mask and method for making the same

A method of forming metal contact terminals (35) of a determined size having an insulating substrate (17) with a metal land (18) formed thereon and a passivating layer (19) provided with an opening exposing a part of the metal land by forming intermediate metal contact pad (33') in the contact opening, applying and patterning a photoresist, delineating the intermediate metal contact pad (33') using pattern (31) as an in-situ mask, depositing a lead-tin solder layer (34') over a metal mask to form a solder bump (34') on the final metal contact pad, and reflowing the solder to form a solder ball (34). Thereby achieving the metal contact terminal (35) at the contact pad site. The above method has applicability to the fabrication of contact terminals for high density/high count I/O connections for advanced semiconductor chips that are appropriate for flip-chip (C4) or face-down bonding thereof on metallized ceramic (MC) substrates.

Growing community of inventors

Baulne, France

Georges Henri Robert