George Amos Carson, Jr

Title: George Amos Carson, Jr.: Innovator in Microelectronic Assembly

Introduction

George Amos Carson, Jr. is a notable inventor based in Rowland Heights, California. He has made significant contributions to the field of microelectronics, particularly through his innovative patent that addresses the challenges of microelectronic assembly.

Latest Patents

Carson holds a patent for a "Method of forming a microelectronic assembly with a particulate free underfill material." This invention involves a microelectronic assembly that incorporates a particulate free underfill material. The assembly includes a substrate with a plurality of bond pads disposed on a substantially planar die attach region, and an integrated circuit die with a die face and a plurality of bond pads. The design ensures that the die face is superimposed over the substrate die attach region, with each die face bond pad aligned with its corresponding substrate bond pad. The gap between the die face and the die attach region is not greater than about 20 microns, and each bond pad is connected by a solder connection. A particulate free polymeric material is disposed in the gap, encapsulating each of the solder connections.

Career Highlights

Carson has worked with Motorola Corporation, a leading company in the telecommunications and electronics industry. His work at Motorola has allowed him to contribute to advancements in microelectronic technologies.

Collaborations

Throughout his career, Carson has collaborated with notable colleagues, including Daniel Roman Gamota and Robert Kenneth Doot. These collaborations have further enriched his work and contributions to the field.

Conclusion

George Amos Carson, Jr. is a distinguished inventor whose work in microelectronic assembly has paved the way for advancements in the industry. His innovative patent reflects his expertise and commitment to improving microelectronic technologies.