The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Nov. 12, 1999
Daniel Gamota, Palatine, IL (US);
Robert Kenneth Doot, Schaumburg, IL (US);
George Amos Carson, Jr., Rowland Heights, CA (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A microelectronic assembly ( ) incorporating a particulate free underfill material ( includes a substrate ( ) having a plurality of bond pads ( ) disposed on a substantially planar die attach region ( ), and an integrated circuit die ( ) having a die face ( ) and a plurality of bond pads ( ). The die face ( ) is superimposed over the substrate die attach region ( ) so that each of the die face bond pads ( ) is generally aligned with a corresponding one of the substrate bond pads ( ) and such that the die face is spaced apart from the die attach region by a gap not greater than about 20 microns. Each of the die face bond pads ( ) is connected to its corresponding one of the substrate bond pads ( ) by a solder connection ( ). A particulate free polymeric material ( ) is disposed in the gap, with the polymeric material substantially encapsulating each of the solder connections.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile