This inventor holds 1 USPTO granted patent, plus 1 CIPO patent and 1 EPO patent. Top assignee: Microsemi Corporation. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: George A Digiacomo: Innovator in Microelectronic Packaging
Introduction
George A Digiacomo is a notable inventor based in Phoenix, AZ (US). He has made significant contributions to the field of microelectronics, particularly in the development of advanced packaging solutions. His innovative designs have paved the way for more reliable and efficient electronic devices.
Latest Patents
Digiacomo holds a patent for a "Plastic surface mount large area power device." This invention features a low profile, 1 or 2 die design, and utilizes surface mount technology for high power microelectronic packages. The design incorporates coefficient of expansion (CTE) matched materials, such as Silicon die to Molybdenum conductor for bond pads. This CTE matching allows the device to endure extreme temperature cycling without failure or cracking. The package is versatile and can be used for applications such as transient voltage suppression (TVS), Schottky diodes, rectifier diodes, or high voltage diodes. Additionally, the use of a heat sink metal conductor with a high modulus of elasticity enables a thin wall plastic locking mechanism, minimizing the package's footprint.
Career Highlights
George A Digiacomo is currently employed at Microsemi Corporation, where he continues to innovate in the field of microelectronics. His work has been instrumental in enhancing the performance and reliability of electronic components.
Collaborations
Digiacomo has collaborated with several talented individuals, including Tracy A Autry and Stephen G Kelly. These partnerships have contributed to the successful development of his innovative technologies.
Conclusion
George A Digiacomo's contributions to microelectronic packaging demonstrate his commitment to innovation and excellence in the field. His patented designs are paving the way for advancements in electronic device reliability and efficiency.