The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2010
Filed:
Sep. 29, 2006
Tracy Autry, Trabuco Canyon, CA (US);
Stephen G. Kelly, Melrose, MA (US);
George A. Digiacomo, Phoenix, AZ (US);
Christopher Alan Barnes, Arvada, CO (US);
Tracy Autry, Trabuco Canyon, CA (US);
Stephen G. Kelly, Melrose, MA (US);
George A. Digiacomo, Phoenix, AZ (US);
Christopher Alan Barnes, Arvada, CO (US);
Microsemi Corporation, Irving, CA (US);
Abstract
A low profile, 1 or 2 die design, surface mount high power microelectronic package with coefficient of expansion (CTE) matched materials such as Silicon die to Molybdenum conductor (bond pads). The CTE matching of the materials in the package enables the device to withstand repeated, extreme temperature range cycling without failing or cracking. The package can be used for transient voltage suppression (TVS), Schottky diode, rectifier diode, or high voltage diodes, among other uses. The use of a heat sink metal conductor that has a very high modulus of elasticity allows for a very thin wall plastic locking to be utilized in order to minimize the footprint of the package.