Mesa, AZ, United States of America

Geoffrey L Reid

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Geoffrey L Reid. Retrieved from https://idiyas.com/inventor/geoffrey-l-reid

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Innovations by Geoffrey L Reid

Introduction

Geoffrey L Reid is an accomplished inventor based in Mesa, AZ. He is known for his significant contributions to the field of electronic assembly, particularly in the design of printed circuit board housing clamps. His innovative work has led to the development of a patented technology that enhances the functionality of integrated circuit packages.

Latest Patents

Geoffrey holds a patent for a printed circuit board housing clamp. This invention involves an electronic assembly that includes one or more conductive clamps, which are utilized to supply current to an integrated circuit (IC) package. The clamps are attached to a printed circuit (PC) board, facilitating the flow of current to the IC package and receiving returned current. Each clamp makes contact with specific contact pads on both the PC board and the IC package, ensuring efficient electrical connectivity. The design also incorporates vias and conductive planes within the package to manage current flow effectively.

Career Highlights

Geoffrey L Reid is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His role at Intel has allowed him to work on cutting-edge technologies and contribute to the development of innovative electronic solutions.

Collaborations

Throughout his career, Geoffrey has collaborated with talented individuals such as Farzaneh Yahyaei-moayyed and Glenn E Stewart. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Geoffrey L Reid's contributions to the field of electronic assembly through his patented innovations demonstrate his expertise and commitment to advancing technology. His work continues to impact the industry positively, showcasing the importance of innovation in electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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