Company Filing History:
Years Active: 2010-2011
Title: **Innovations by Inventor Gavin Appel in Wire Bonding Technology**
Introduction
Gavin Appel, an accomplished inventor based in Allentown, PA, has made significant contributions to the field of integrated circuit technology. With two patents to his name, Appel has introduced innovative methods that enhance wire bonding operations, a crucial aspect in the design of integrated circuits.
Latest Patents
Gavin Appel's latest patents showcase his ingenuity and expertise in wire bonding techniques. The first patent, titled "Method and article of manufacture for wire bonding with staggered differential wire bond pairs," presents a method for executing wire-bonding operations in integrated circuits. This method involves bonding a wire to a primary bond site in the circuit and terminating it at a secondary bond site. The process is repeated for several differential wire bond pairs, ensuring that proximate pairs possess notably different wire bond profiles.
The second patent, "Integrated circuit with staggered differential wire bond pairs," describes an integrated circuit packaged with one or more circuit elements. This invention features at least two differential wire bond pairs that provide essential connections for the circuit elements. Notably, the proximate wire bond pairs also have contrasting wire bond profiles, optimizing the performance and reliability of the integrated circuit.
Career Highlights
Gavin Appel is currently employed at Agere Systems Inc., where he leverages his expertise to advance cutting-edge technologies. His continuous efforts in research and development have positioned him as a key player in the domain of integrated circuits, particularly regarding wire bonding methodologies.
Collaborations
During his career, Gavin has collaborated with talented colleagues such as Ashley Rebelo and Christopher J Wittensoldner. These partnerships have fostered an environment of innovation and creativity, allowing for the successful implementation of various projects that enhance the functionality of integrated circuits.
Conclusion
In summary, Gavin Appel stands out as a dedicated inventor whose work in wire bonding technology has produced valuable advancements within the field of integrated circuits. His patents reflect a commitment to innovation and excellence, contributing significantly to the progress of modern electronic design. As he continues to collaborate and push the boundaries of technology, Appel remains a notable figure in the world of inventions.