The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2011
Filed:
Jan. 22, 2010
Gavin Appel, Allentown, PA (US);
Ashley Rebelo, Emmaus, PA (US);
Christopher J. Wittensoldner, Alburtis, PA (US);
Gavin Appel, Allentown, PA (US);
Ashley Rebelo, Emmaus, PA (US);
Christopher J. Wittensoldner, Alburtis, PA (US);
Agere Systems, Allentown, PA (US);
Abstract
A method and article of manufacture for performing wire-bonding operations in an integrated circuit. In one aspect, the operations include the steps of bonding a wire to a first bond site in the integrated circuit and terminating the wire at a second bond site. The bonding and terminating steps are repeated for at least two differential wire bond pairs, and proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles.