Shanghai, China

Gary Zheng


Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations by Gary Zheng: Pioneering Semiconductor Device Packaging

Introduction

Gary Zheng, an inventive mind located in Shanghai, China, is making significant strides in the realm of semiconductor technology. With one patent to his name, Zheng exemplifies the spirit of innovation in the technology sector. He currently serves at Western Digital Technologies, Inc., where his contributions focus on enhancing thermal management in semiconductor devices.

Latest Patents

Gary Zheng's notable patent is titled "Semiconductor device package having thermally conductive layers for heat dissipation." This invention incorporates a substrate, a heat-generating component located on the substrate's surface, and an encapsulant that partially covers the heat-generating component. A first heat-conducting layer is strategically placed between the encapsulant and the heat-generating component, ensuring effective heat dissipation. Additionally, one or more pillars make contact with the first heat-conducting layer and extend to the encapsulant's outer surface, thereby linking to a second heat-conducting layer positioned on that surface. This innovative approach addresses critical thermal management challenges in semiconductor devices.

Career Highlights

Throughout his career, Gary Zheng has focused on advancing semiconductor technologies and contributing to the field's development. His position at Western Digital Technologies, Inc. has allowed him the opportunity to drive forward-thinking projects and showcase his talents in research and development.

Collaborations

Gary is known for his collaboration with esteemed colleagues, including Yazhou Zhang and Jiandi Du. Together, they contribute to a dynamic research environment, encouraging the exchange of inventive ideas that fuel their ongoing projects.

Conclusion

Gary Zheng stands out as a pivotal inventor in the semiconductor domain, with his innovative patent addressing vital aspects of heat dissipation. His work at Western Digital Technologies, Inc. and collaborations with talented colleagues underline the importance of teamwork in fostering advancements in technology. Zheng's contributions exemplify the continuous evolution of innovation within the semiconductor industry.

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