The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Apr. 13, 2021
Western Digital Technologies, Inc., San Jose, CA (US);
Yazhou Zhang, Shanghai, CN;
Jiandi Du, Shanghai, CN;
Hope Chiu, Shanghai, CN;
Cong Zhang, Shanghai, CN;
Fen Yu, Shanghai, CN;
Ada Shen, Shanghai, CN;
Gary Zheng, Shanghai, CN;
Honny Chen, Shanghai, CN;
Western Digital Technologies, Inc., San Jose, CA (US);
Abstract
A semiconductor device package includes a substrate, a heat-generating component positioned on a surface of the substrate, and an encapsulant at least partially covering the heat-generating component and having an outer surface. A first heat-conducting layer is disposed between the encapsulant and the first heat-generating component. One or more pillars are in contact with the first heat-conducting layer and extend to the outer surface of the encapsulant and contact a second heat-conducting layer disposed on the outer surface of the encapsulant.