Western Digital Technologies, Inc.

Gary Zheng

Cong Zhang

Yazhou Zhang

Hope Chiu

Jiandi Du

Fen Yu

Honny Chen

Ada Shen

A semiconductor device package includes a substrate, a heat-generating component positioned on a surface of the substrate, and an encapsulant at least partially covering the heat-generating component and having an outer surface. A first heat-conducting layer is disposed between the encapsulant and the first heat-generating component. One or more pillars are in contact with the first heat-conducting layer and extend to the outer surface of the encapsulant and contact a second heat-conducting layer disposed on the outer surface of the encapsulant.

Semiconductor device package having thermally conductive layers for heat dissipation

Growing community of inventors

Shanghai, China

Gary Zheng