Jericho, VT, United States of America

Gary Ray Hill


Average Co-Inventor Count = 5.8

ph-index = 6

Forward Citations = 101(Granted Patents)


Location History:

  • Jerico, VT (US) (1996)
  • Jericho, VT (US) (1996 - 2000)
  • Essex Junction, VT (US) (2014 - 2016)

Company Filing History:


Years Active: 1996-2016

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10 patents (USPTO):

Title: Innovations by Gary Ray Hill: A Look at His Contributions in Wafer Level Chip Scale Packaging

Introduction

Gary Ray Hill, an accomplished inventor based in Jericho, Vermont, has made significant contributions to the field of technology with a total of ten patents to his name. His work primarily focuses on advancements in electronic packaging, particularly in the area of millimeter wave wafer level chip scale packaging (WLCSP).

Latest Patents

Among his latest patents, Gary has developed innovative structures and methods related to WLCSP devices. These patents detail various embodiments of WLCSP structures, incorporating techniques for tuning and enhancing performance. His WLCSP structure integrates a printed circuit board (PCB) trace connection with ground connections, a set of ground solder balls, and chip pads, all working in harmony to improve the efficiency of electronic devices. The specifications also include a signal interconnect designed to be electrically isolated from the PCB ground plane, optimizing signal integrity.

Career Highlights

Gary Ray Hill is known for his role at the International Business Machines Corporation (IBM), where he leverages his expertise in electronic packaging to drive innovation. His extensive track record in developing patented technology showcases his commitment to advancing the industry and providing solutions for contemporary electronic needs.

Collaborations

Throughout his career, Gary has collaborated with notable colleagues, including Anthony P. Ingraham and Voya Rista Markovich. This collaborative spirit not only enhances the innovation process but also fosters an environment of shared expertise and creative problem-solving within IBM.

Conclusion

Gary Ray Hill's contributions to millimeter wave wafer level chip scale packaging signify important advancements in the realm of electronic design and technology. His ten patents reflect a dedication to innovation and collaboration, and they play a vital role in shaping the future of electronic packaging solutions. With a career rooted in technological advancement, Gary continues to inspire upcoming inventors and technologists in the field.

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