Austin, TX, United States of America

Gary Pfeffer


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2000-2017

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3 patents (USPTO):Explore Patents

Title: Innovations by Gary Pfeffer

Introduction

Gary Pfeffer is an accomplished inventor based in Austin, TX. He has made significant contributions to the field of microelectromechanical systems (MEMS) with a total of 3 patents to his name. His work focuses on innovative methods that enhance the functionality and efficiency of MEMS devices.

Latest Patents

One of Gary's latest patents is titled "Etch release residue removal using anhydrous solution." This patent describes a method for making a MEMS device that involves etching away a sacrificial material layer to release a mechanical element. The process leaves a residue that can be effectively removed using an anhydrous solution, which may include acetic acid, isopropyl alcohol, or acetone. Another notable patent is "Method for forming a cavity capable of accessing deep fuse structures and device containing the same." This invention outlines a deep etch process for forming a cavity to a structure, such as a poly fuse, ensuring that non-etched dielectric material remains on the sidewalls of the etch cavity.

Career Highlights

Throughout his career, Gary has worked with prominent companies such as Motorola Corporation and NXP USA, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in the field of MEMS technology.

Collaborations

Gary has collaborated with talented individuals in his field, including Joel Patrick Mitchell and Fred Cumplan. These partnerships have contributed to the advancement of his inventions and the overall progress in MEMS technology.

Conclusion

Gary Pfeffer is a notable inventor whose work in MEMS technology has led to valuable innovations. His patents reflect a commitment to improving device functionality and efficiency, making significant strides in the industry.

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