Gary Paul Vlasak

Title: Innovations of Gary Paul Vlasak

Introduction

Gary Paul Vlasak is a notable inventor based in Owego, NY (US). He has made significant contributions to the field of electronics through his innovative patents. With a total of five patents to his name, Vlasak has focused on enhancing the precision and efficiency of solder application in circuit packages.

Latest Patents

Vlasak's latest patents include a process for the selective application of solder to circuit packages. This process allows for small, closely spaced deposits of solder materials to be formed with high volumetric accuracy and uniformity of shape. The method involves depositing a layer of conductive material over surfaces of a dielectric layer that has apertures or recesses. By masking regions of the conductive material with a patterned dielectric layer, he enables electroplating of solder materials onto the exposed regions. The process also includes removing the mask and portions of the conductive material through selective etching and reflowing solder away from the surfaces of the apertured dielectric layer. Additionally, he has developed an electroplating apparatus that enhances uniformity within blind apertures through fluid jet sparging and cathode agitation.

Career Highlights

Vlasak is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in the field of electronics. His work has significantly impacted the efficiency of solder application processes, making them more precise and reliable.

Collaborations

Some of his notable coworkers include Voya Rista Markovich and Richard Stuart Zarr. Their collaborative efforts contribute to the advancement of technology within their field.

Conclusion

Gary Paul Vlasak's contributions to the field of electronics through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and improve manufacturing processes.