The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 1994
Filed:
Jul. 26, 1991
Eric P Dibble, Endicott, NY (US);
Steven L Hanakovic, Vestal, NY (US);
Voya R Markovich, Endwell, NY (US);
Daniel S Niedrich, Kasson, MN (US);
Gary P Vlasak, Owego, NY (US);
Richard S Zarr, Apalachin, NY (US);
Richard C Senger, Vestal, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Process is described for applying large quantities of solder to small areas, such as the lands in a high density card, to which it is intended to surface mount electronic devices or directly attach circuitized chips. The land area is temporarily extended by depositing a relatively thin layer of metal beyond the perimeter of the land, wave soldering to deposit excess solder on the extended land region, and reflow, whereby the thin layer of metal dissolves into the solder, causing the solder to retract to the dimensions of the original land. Because the volume of solder is increased, the strength and reliability of the solder joint is greatly improved.