Location History:
- Apalachin, NY (US) (1991)
- Kasson, MN (US) (1994)
Company Filing History:
Years Active: 1991-1994
Title: The Innovations of Daniel S Niedrich
Introduction
Daniel S Niedrich is a notable inventor based in Apalachin, NY (US). He has made significant contributions to the field of electronics through his innovative patents. With a total of two patents to his name, Niedrich has focused on enhancing the reliability and efficiency of soldering processes in electronic devices.
Latest Patents
Niedrich's latest patents include "Applying solder to high density substrates" and "Copper doped low melt solder for component assembly and rework." The first patent describes a process for applying large quantities of solder to small areas, such as the lands in a high-density card, intended for surface mounting electronic devices or directly attaching circuitized chips. This process temporarily extends the land area by depositing a thin layer of metal beyond the perimeter of the land, followed by wave soldering to deposit excess solder. The reflow process allows the thin layer of metal to dissolve into the solder, improving the strength and reliability of the solder joint. The second patent introduces low melting temperature copper-containing solders for soldering and rework on copper surfaces, which helps inhibit the dissolution of the copper surface during the soldering process.
Career Highlights
Niedrich has had a distinguished career at International Business Machines Corporation (IBM), where he has applied his expertise in soldering technologies. His work has contributed to advancements in electronic manufacturing and assembly processes.
Collaborations
Throughout his career, Niedrich has collaborated with talented individuals such as Eric P Dibble and Steven L Hanakovic. These collaborations have fostered innovation and the development of new technologies in the field.
Conclusion
Daniel S Niedrich's contributions to the field of electronics through his patents demonstrate his commitment to innovation and improvement in soldering processes. His work continues to influence the industry and enhance the reliability of electronic devices.