Endicott, NY, United States of America

Eric P Dibble


Average Co-Inventor Count = 2.8

ph-index = 6

Forward Citations = 187(Granted Patents)


Company Filing History:


Years Active: 1983-2002

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8 patents (USPTO):

Title: Innovations of Eric P Dibble

Introduction

Eric P Dibble is a notable inventor based in Endicott, NY (US), recognized for his contributions to the field of technology with a total of 8 patents. His work primarily focuses on advancements in circuit packaging and pin grid array technologies.

Latest Patents

One of his latest patents is the "Process of producing plastic pin grid array." This innovative pinning process includes steps such as gold-plating through-holes in a laminate carrier and crimping gold or gold-plated pins located in the through-holes. This method forms a pin head on the top and a pin bulge on the bottom of the laminate carrier, resulting in a reliable mechanical and electrical connection without the need for lead-containing solders and pastes. Another significant patent is the "Method of improved cavity BGA circuit package," which introduces an improved bonding system where a metal heat spreader is bonded to a semiconductor chip using a two adhesive system. This system combines a first adhesive with high bond strength and a second adhesive that exhibits high thermal conductivity.

Career Highlights

Eric P Dibble has made significant strides in his career at the International Business Machines Corporation (IBM). His innovative approaches have led to advancements in the efficiency and reliability of electronic components.

Collaborations

Throughout his career, Dibble has collaborated with notable coworkers, including Eric H Laine and Stephen Wesley MacQuarrie, contributing to various projects and innovations.

Conclusion

Eric P Dibble's work exemplifies the spirit of innovation in technology, particularly in circuit packaging and pin grid array processes. His patents reflect a commitment to improving electronic connections and enhancing the performance of semiconductor devices.

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