North Kingstown, RI, United States of America

Gary D Eastman




Average Co-Inventor Count = 4.8

ph-index = 5

Forward Citations = 95(Granted Patents)


Company Filing History:


Years Active: 2004-2012

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6 patents (USPTO):Explore Patents

Title: Innovations by Inventor Gary D. Eastman

Introduction

Gary D. Eastman is an accomplished inventor based in North Kingstown, Rhode Island, whose contributions to the field of technology are notable. With a portfolio that includes six patents, Eastman has made significant advancements in interconnection devices and integrated circuit packaging. His work reflects a blend of engineering proficiency and innovative thinking, making him a prominent figure in his field.

Latest Patents

Two of Gary D. Eastman's latest patents exemplify his innovative approach:

1. **High Speed, High Density Interconnection Device**: This patent describes an intercoupling component designed for digital or analog transmission systems. It features a segment made from electrically insulative material, with a multitude of holes arranged in a predetermined layout. The design integrates shield members made from electrically conductive materials for connection with the chassis ground circuit. Additionally, it incorporates groups of electrically conductive contacts that enable the transmission of single-ended and differential signals, while also adjusting the differential impedance between signal contacts through a strategically designed cavity.

2. **Compression Device for Integrated Circuit Packages**: Eastman’s compression device is engineered with a frame that houses an integrated circuit package and a pressor. This innovative design utilizes ramps with both flat and sloped portions to facilitate the movement of the pressor upon the application of force. This unique mechanism ensures efficient engagement during operation, enhancing performance and reliability in circuit packaging.

Career Highlights

Gary D. Eastman has had a diverse career, predominantly at Advanced Interconnections Corporation and Advanced Interconnection Corporation. His experience in these organizations has been pivotal in his development as an inventor, allowing him to leverage his skills in a practical environment that fosters innovation.

Collaborations

Throughout his career, Eastman has collaborated with noteworthy colleagues such as Erol D. Saydam and Michael N. Perugini. These collaborations have contributed to his ability to innovate and refine his ideas, resulting in significant advancements in technology.

Conclusion

In conclusion, Gary D. Eastman stands out as a leading inventor whose work has impacted the realms of interconnection technology and integrated circuit packaging. His consistent drive to innovate and collaborate with other professionals ensures that his contributions will remain influential in the future of technology.

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