The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2012

Filed:

Apr. 04, 2006
Applicants:

Michael N. Perugini, Monroe, CT (US);

Gary D. Eastman, North Kingstown, RI (US);

Alfred J. Langon, Cranston, RI (US);

Raymond A. Prew, Foster, RI (US);

Erol D. Saydam, Foster, RI (US);

Inventors:

Michael N. Perugini, Monroe, CT (US);

Gary D. Eastman, North Kingstown, RI (US);

Alfred J. Langon, Cranston, RI (US);

Raymond A. Prew, Foster, RI (US);

Erol D. Saydam, Foster, RI (US);

Assignee:

Advanced Interconnections Corp., West Warwick, RI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals. The intercoupling component may include a cavity located between signal contacts to adjust the differential impedance between signal contacts.


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