Gao Fan

Title: Innovations by Gao Fan in Three Dimensional Circuit Modules

Introduction

Gao Fan is an accomplished inventor based in Hangzhou, China. He has made significant contributions to the field of circuit technology, particularly with his innovative approach to three-dimensional circuit modules. His work has the potential to enhance the efficiency and functionality of electronic devices.

Latest Patents

Gao Fan holds a patent for a three-dimensional circuit module and the method for manufacturing it. This invention includes a plurality of printed circuit boards (PCBs) located on different faces, where the surfaces of the PCBs incorporate circuit modules. The design features multiple circuit assemblies connected through components, including at least one first circuit assembly that consists of a first main board and at least one first side board, which are situated on different faces. The first main board and side board are produced through an integrated curing molding process, allowing for the connection of adjacent PCBs.

Career Highlights

Gao Fan is currently employed at Silergy Semiconductor Technology (Hangzhou) Ltd. His role at the company allows him to apply his expertise in circuit design and innovation. His work is instrumental in advancing the company's technological capabilities and product offerings.

Collaborations

Gao Fan collaborates with his coworker, Chen Zhao, to further enhance their projects and drive innovation within their field.

Conclusion

Gao Fan's contributions to the development of three-dimensional circuit modules exemplify his innovative spirit and technical expertise. His patent reflects a significant advancement in circuit technology, showcasing the potential for improved electronic device performance.