The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Dec. 09, 2022
Silergy Semiconductor Technology (Hangzhou) Ltd, Hangzhou, CN;
Silergy Semiconductor Technology (Hangzhou) LTD, Hangzhou, CN;
Abstract
A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.