Bengaluru, India

Gagan Dobhal


Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Gagan Dobhal: Innovator in Substrate Handling Systems

Introduction

Gagan Dobhal is a notable inventor based in Bengaluru, India. He has made significant contributions to the field of substrate handling systems, particularly in the context of chemical mechanical polishing (CMP) processing. His innovative work has implications for the semiconductor industry, where precision and efficiency are paramount.

Latest Patents

Gagan Dobhal holds a patent for "Substrate handling systems and methods for CMP processing." This patent describes a system and method for sequential single-sided CMP processing of opposite facing surfaces of a silicon carbide (SiC) substrate. The method involves urging a first surface of the substrate against one of a plurality of polishing pads, which are arranged on corresponding rotatable polishing platens. Additionally, the method includes transferring the substrate between various stations using an end effector, ensuring precise alignment and handling throughout the process. Gagan has 1 patent to his name.

Career Highlights

Gagan Dobhal is currently employed at Applied Materials, Inc., a leading company in the semiconductor equipment industry. His role involves developing advanced technologies that enhance the efficiency and effectiveness of substrate processing. His expertise in CMP processing has positioned him as a valuable asset in his field.

Collaborations

Gagan collaborates with various professionals in his industry, including his coworker Manoj A Gajendra. Together, they work on innovative solutions that push the boundaries of substrate handling technologies.

Conclusion

Gagan Dobhal's contributions to substrate handling systems and CMP processing highlight his role as an influential inventor in the semiconductor industry. His innovative patent and work at Applied Materials, Inc. demonstrate his commitment to advancing technology in this critical field.

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