Applied Materials, Inc.

Gagan Dobhal

Jeonghoon Oh

Manoj A Gajendra

Jamie Leighton

Van H Nguyen

John Anthony Garcia

Manoj Balakumar

Sanjay Bhanurao Chavan

Chetan Kumar Mylappanahalli Narasingaiah

A system and method for sequential single-sided CMP processing of opposite facing surfaces of a silicon carbide (SiC) substrate are disclosed. A method includes urging a first surface of a substrate against one of plurality of polishing pads, wherein the plurality of polishing pads are disposed on corresponding ones of a plurality of rotatable polishing platens. The method includes transferring, using the first side of the end effector, the substrate from the substrate carrier loading station to a substrate alignment station. The method includes transferring, using the first side of the end effector, the substrate from the substrate alignment station to a substrate carrier loading station. The method includes urging a second surface of the substrate against one of the plurality of polishing platens.

Substrate handling systems and methods for CMP processing

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Bengaluru, India

Gagan Dobhal