Hong Kong, China

Fung Ling Yeung

This inventor holds 1 USPTO granted patent. Top assignee: Intelligent Memory Limited. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fung Ling Yeung. Retrieved from https://idiyas.com/inventor/fung-ling-yeung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations by Fung Ling Yeung in PCB Assembly Technology.

Introduction

Fung Ling Yeung is an innovative inventor based in Hong Kong, CN. He has made significant contributions to the field of electronics, particularly in the area of printed circuit board assembly (PCBA) technology. His work focuses on improving the efficiency and effectiveness of dismantling defective components in electronic devices.

Latest Patents

Fung Ling Yeung holds a patent for a system designed for the dismantling of double-sided PCBA. This innovative system addresses the challenges associated with removing defective ball grid array (BGA) chips. The patent describes a process that includes a fix stage and a cooling stage. The fix stage features at least one shield that prevents hot air from a hot air gun from affecting adjacent BGA chips. The cooling stage is designed to prevent overheating of BGA chips located on the opposite side of the double-sided PCBA by effectively conducting heat away during the dismantling process. This patent showcases his commitment to enhancing the reliability and safety of electronic repairs.

Career Highlights

Fung Ling Yeung is currently employed at Intelligent Memory Limited, where he continues to develop innovative solutions in the electronics sector. His expertise in PCBA technology has positioned him as a valuable asset to his company and the industry at large. With a focus on practical applications, Fung has demonstrated his ability to translate complex engineering concepts into functional designs.

Collaborations

Fung has collaborated with talented individuals such as Ho Wai Phyllis Leung and Nok Him Chan. These partnerships have allowed him to leverage diverse skills and perspectives, further enhancing the quality of his work.

Conclusion

Fung Ling Yeung's contributions to the field of electronics, particularly through his patent for dismantling double-sided PCBA, highlight his innovative spirit and dedication to improving technology. His work not only addresses current challenges but also paves the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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