The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Mar. 17, 2023
Applicant:

Intelligent Memory Limited, Kwai Chung, HK;

Inventors:

Ho Wai Phyllis Leung, Ma Wan, HK;

Fung Ling Yeung, Tuen Mun, HK;

Nok Him Chan, Sheung Shui, HK;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0486 (2013.01); H05K 1/0203 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A system for dismantling defective BGA chips from double-sided PCBA having a fix stage and a cooling stage. The fix stage includes at least one shield that prevents hot air from a hot air gun to heat BGA chips that are adjacent to the defective BGA chips. The cooling stage prevents overheating of the BGA chips that are on the opposite side of the double-sided PCBA by conducting heat away from the BGA chips during the process.


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