Fumitake Taniguchi

Title: Fumitake Taniguchi: Innovator in Semiconductor Technology

Introduction

Fumitake Taniguchi is a prominent inventor based in Kumagaya, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on enhancing the reliability and efficiency of semiconductor modules.

Latest Patents

Among his latest patents are an electrode structure and its manufacturing method, as well as a highly reliable semiconductor module. This semiconductor module features a satisfactory bonding strength in the electrical bonded portion. In this design, a semiconductor chip is mounted on a circuit board. The circuit board consists of an insulating ceramic substrate on which a metal circuit plate is formed, allowing for the implementation of the semiconductor chip. The semiconductor chip and metal circuit plate are interconnected using an aluminum bonding wire. A coating layer is applied to the connected portion between the metal circuit plate and bonding wire to ensure excellent conjunction. This coating layer comprises a nickel (Ni) layer, a P-distributed palladium (Pd) layer, and an Au layer in increasing order. The P-distributed Pd layer is enhanced with phosphorus (P), resulting in a higher P concentration on the Ni layer compared to the Au layer side.

Career Highlights

Fumitake Taniguchi is currently employed at Hitachi Metals, Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the reliability of electronic components.

Collaborations

He has collaborated with notable coworkers, including Kimio Uchida and Masahiro Takahashi, contributing to various projects and innovations in the field.

Conclusion

Fumitake Taniguchi's contributions to semiconductor technology exemplify his dedication to innovation and excellence. His patents reflect a commitment to improving the performance and reliability of electronic components.