The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Dec. 04, 2008
Setsuo Andoh, Kumagaya, JP;
Fumitake Taniguchi, Tottori, JP;
Setsuo Andoh, Kumagaya, JP;
Fumitake Taniguchi, Tottori, JP;
Hitachi Metals, Ltd., Tokyo, JP;
Abstract
There is a highly reliable semiconductor module having a satisfactory bonding strength in the electrical bonded portion. In the semiconductor module, a semiconductor chipis mounted on a circuit board. In the circuit board, on an insulating ceramic substrateis formed a metal circuit plateon which the semiconductor chipis implemented. The semiconductor chipand metal circuit plateare connected with each other by an aluminum bonding wire. In the connected portion between the metal circuit plateand bonding wire, a coating layerfor excellent conjunction therebetween is mounted. The coating layer, as shown in an enlarged diagram, is made up of a nickel (Ni) layer, a P-distributed palladium (Pd) layer, and an Au layerin increasing order. To the P-distributed Pd layeris added P (phosphorous) and, the P concentration on the Ni layeris higher than that on the Au layer side