Fumio Miyagawa

Title: Fumio Miyagawa: Innovator in High Frequency Element Packaging

Introduction

Fumio Miyagawa is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of electronic packaging, particularly in the design and manufacturing of high frequency element enclosures. With a total of 3 patents to his name, Miyagawa's work has had a lasting impact on the industry.

Latest Patents

Miyagawa's latest patents include innovative designs for coaxial line assemblies and metal wall enclosures. One of his patents describes a coaxial line assembly for a package housing a high frequency element. This assembly features a metal wall with a hole that has a step, creating an inner and outer hole portion. A lead for transmitting high frequency signals is hermetically sealed within the outer hole portion using glass. Additionally, a sealing plate made of dielectric material closes the inner hole portion, ensuring optimal performance.

Another patent outlines a process for creating a metal wall enclosure for electronic elements. This process involves forming a metal sidewall and a bottom plate from a sheet of metal stock. The design includes strategically placed apertures for connectors, allowing for seamless connections to the housed electronic elements. The method emphasizes the importance of hermetically sealing the components to maintain the integrity of the enclosure.

Career Highlights

Throughout his career, Fumio Miyagawa has worked with prominent companies such as Shinko Electric Industries Co., Ltd. and Fujitsu Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in electronic packaging.

Collaborations

Miyagawa has collaborated with talented individuals in the field, including Takaharu Miyamoto and Hiroyuki Sakai. These partnerships have fostered innovation and have led to the development of cutting-edge technologies in electronic packaging.

Conclusion

Fumio Miyagawa's contributions to the field of electronic packaging are noteworthy. His innovative patents and collaborations have significantly advanced the technology used in high frequency element enclosures. His work continues to influence the industry and inspire future innovations.