Fumio Arase

Title: Fumio Arase: Innovator in Electronic Component Packaging

Introduction

Fumio Arase is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of electronic component packaging, holding three patents to his name. His work focuses on improving the efficiency and reliability of electronic components, particularly in the context of printed circuit boards.

Latest Patents

Arase's latest patents include an electronic component package, a printed circuit board, and a method for inspecting the printed circuit board. One of his key innovations is the ball grid array (BGA) electronic component package, which features a design that enhances mounting efficiency while preventing the breaking away of footprints at the circuit-connecting portions. The BGA package incorporates reinforcing bumps located outward of the conventional circuit-connecting bumps. This design ensures that even if a shock is applied to the BGA package, particularly at its most sensitive outer portions, the shock is absorbed by the reinforcing bumps. Consequently, this prevents the footprints on both the BGA package and the printed circuit board from cracking or breaking away.

Career Highlights

Throughout his career, Fumio Arase has worked with prominent companies such as Fujitsu Corporation and Fujitsu Limited. His experience in these organizations has allowed him to refine his expertise in electronic component design and manufacturing.

Collaborations

Arase has collaborated with notable coworkers, including Yasuhiro Ichihara and Seiji Kogure. Their collective efforts have contributed to advancements in the field of electronic components.

Conclusion

Fumio Arase's innovative work in electronic component packaging has significantly impacted the industry. His patents reflect a commitment to enhancing the reliability and efficiency of electronic devices. His contributions continue to influence the design and manufacturing of electronic components today.