Fujitsu Corporation

Fujistu Limited

Fumio Arase

Yasuhiro Ichihara

Hiroshi Iimura

Seiji Kogure

Toshikatsu Hino

Takashi Ohshima

A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.

Electronic component package, printed circuit board, and method of inspecting the printed circuit board

A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package e.g. when a printed circuit board having the BGA package mounted thereon is carelessly dropped during the manufacturing work, at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.

Electronic component package, printing circuit board, and method of inspecting the printed circuit board

An automatic IC mounting process for mounting a plurality of ICs on an upper surface of a printed circuit board in accordance with a predetermined sequence program. Each of the ICs has a plurality of leads, each of which is to be inserted into a predetermined corresponding through-hole of the printed circuit board. The process includes: (i) a step for inserting the leads of an IC into the through-holes of the printed circuit board; (ii) a step for detecting whether or not each lead of the IC is correctly inserted into the corresponding through-hole after every step (i); (iii) a step for removing a misinserted IC having a misinserted lead from the printed circuit board and discarding the misinserted IC into a predetermined reject place immediately after a misinsertion is detected in the step (ii); (iv) a step for memorizing the information for identifying the misinserted IC; (v) a step for mounting a predetermined number of subsequent ICs on the printed circuit board in accordance with the predetermined sequence program, leaving the position of the misinserted IC unmounted; (vi) a step for searching for whether or not the information was memorized in the step (iv); and, (vii) a step for preparing a new IC identified by that information and remounting it on the printed circuit board at the position of the misinserted IC.

Growing community of inventors

Kawasaki, Japan

Fumio Arase