Milan, Italy

Fulvio Silvio Tondelli

This inventor holds 3 USPTO granted patents. Top assignees: Stmicroelectronics S.r.l., Stmicroelectronics Gmbh. Active years: 2001-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fulvio Silvio Tondelli. Retrieved from https://idiyas.com/inventor/fulvio-silvio-tondelli

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2001-2003

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3 patents (USPTO):Explore Patents

Title: Innovations of Fulvio Silvio Tondelli in Electronic Engineering

Introduction

Fulvio Silvio Tondelli, an accomplished inventor based in Milan, Italy, has made significant contributions to the field of electronic engineering. With a total of three patents to his name, Tondelli's work focuses on enhancing the performance and functionality of semiconductor packaging, a crucial aspect of modern electronics.

Latest Patents

Among his latest patents, Tondelli developed the "Plated leadframes with cantilevered leads." This innovation involves a sophisticated metal frame manufactured through die stamping, allowing each patterned pin to extend freely without constraints from a metal bridge connection. Additionally, the ends of the pins are coated with layers of noble metals like palladium or gold, ensuring superior performance without the need for cutting or trimming post-production.

Another significant invention is the "Plastic package for an integrated electronic semiconductor device." This patent encapsulates a semiconductor element within a precisely molded plastic body, addressing the challenges posed by thermal stresses during the molding process. The unique concave-shaped mold ensures optimal thickness distribution in the final product, promoting enhanced functionality and reliability.

Career Highlights

Fulvio Silvio Tondelli has dedicated his professional career to innovation in electronic materials and devices. He has worked for prominent companies such as STMicroelectronics S.r.l. and STMicroelectronics GmbH, where he applied his expertise to improve semiconductor technologies. His career reflects a commitment to developing cutting-edge solutions that meet industry demands.

Collaborations

In his pursuit of innovation, Tondelli has collaborated with notable colleagues, including Andrea Giovanni Cigada and Luigi Romano. Their collective expertise in the field has contributed to the successful development and patenting of advanced electronic solutions.

Conclusion

Fulvio Silvio Tondelli's innovative contributions to electronic engineering are marked by insightful patents that address significant challenges in semiconductor technology. His work not only enhances the functionality of electronic devices but also sets a benchmark for future advancements in the field. As the industry continues to evolve, Tondelli's inventions will remain influential in shaping the future of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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