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Hsinchu, Taiwan

Fu-Kang Tien

This inventor holds 9 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 1998-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fu-Kang Tien. Retrieved from https://idiyas.com/inventor/fu-kang-tien

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9

% Patents Active = 77.8

Average Co-Inventor Count = 2.6

ph-index = 3

Forward Citations = 24(Granted Patents)


Location History:

  • Jhubei, TW (2011)
  • Hsin-chu, TW (1998 - 2020)

Company Filing History:

goldMedal9 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 1998-2020

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9 patents (USPTO):Explore Patents
1. 10867831 - Method and apparatus for bonding semiconductor devices (2020-12-15),
2. 10748803 - Method and apparatus for bonding semiconductor devices (2020-08-18),
3. 10269611 - Method and apparatus for bonding semiconductor devices (2019-04-23),
4. 7981212 - Flash lamp annealing device (2011-07-19),
5. 7905109 - Rapid cooling system for RTP chamber (2011-03-15),
6. 7758338 - Substrate carrier, port apparatus and facility interface and apparatus including same (2010-07-20),
7. 5883393 - Source inner shield for eaton NV-10 high current implanter (1999-03-16),
8. 5777209 - Leakage detection apparatus equipped with universal adapter head and (1998-07-07),
9. 5763895 - Source inner shield for eaton NV-10 high current implanter (1998-06-09),

Title: Fu-Kang Tien: Innovator in Semiconductor Bonding Technology

Introduction

Fu-Kang Tien is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on methods and apparatuses that enhance the efficiency and effectiveness of semiconductor device bonding.

Latest Patents

One of Fu-Kang Tien's latest patents is a method and apparatus for bonding semiconductor devices. This innovative method includes several steps: attaching a first die to a flip head of a flip module, flipping the first die with the flip module, and removing the first die from the flip module after flipping. After this, the flip head of the flip module is inspected for contamination, followed by cleaning the flip head with an in situ cleaning module. Finally, a second die is attached to the flip head after the cleaning process.

Career Highlights

Fu-Kang Tien is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approaches have significantly contributed to the company's advancements in semiconductor technology.

Collaborations

Fu-Kang Tien has collaborated with notable coworkers, including Yan-Zuo Tsai and Yang-Chih Hsueh. Their teamwork has fostered an environment of innovation and excellence in their projects.

Conclusion

Fu-Kang Tien's contributions to semiconductor bonding technology exemplify his dedication to innovation in the field. His patents and collaborative efforts continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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