Fu-jin Peng

Title: Fu-jin Peng: Innovator in Electrical Connector Technology

Introduction

Fu-jin Peng is a notable inventor based in Kunshan, China. He has made significant contributions to the field of electrical connector technology. His innovative designs have led to the development of advanced connector assemblies that enhance the performance and reliability of electronic devices.

Latest Patents

One of Fu-jin Peng's key patents is for a socket connector assembly that features a heat sink and a retention member engaging the heat sink. This electrical connector assembly includes a printed circuit board, an electrical connector seated upon the board, and an electronic package coupled to the connector. The design incorporates a frame structure affixed to the printed circuit board, along with a metallic securing seat that has multiple securing posts. A heat sink is positioned on the electronic package, featuring through holes aligned with the securing posts. The assembly also includes fasteners and springs that work together to secure the heat sink in place. The retention member is designed to engage the heat sink effectively, showcasing Peng's innovative approach to connector design. He holds 1 patent in this area.

Career Highlights

Fu-jin Peng has worked with prominent companies in the technology sector, including Foxconn Computer Connector Co., Ltd. and Foxconn Interconnect Technology Limited. His experience in these organizations has allowed him to refine his skills and contribute to various projects that push the boundaries of electrical connector technology.

Collaborations

Throughout his career, Fu-jin Peng has collaborated with talented individuals such as Gong-Cheng Liu and Jia Tan. These partnerships have fostered an environment of innovation and creativity, leading to advancements in the field.

Conclusion

Fu-jin Peng is a distinguished inventor whose work in electrical connector technology has made a lasting impact. His innovative designs and collaborations with industry professionals continue to shape the future of electronic connectivity.