Taipei, Taiwan

Fu-Hsing Chou

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Fu-Hsing Chou: Innovating Integrated Circuit Manufacturing in New Taipei

Introduction: Fu-Hsing Chou is a prominent inventor based in New Taipei, Taiwan, known for his significant contributions to the field of integrated circuit manufacturing. With a focus on improving the mechanics of wafer production, Chou has developed a patent that addresses critical issues in the industry.

Latest Patents: Fu-Hsing Chou holds a patent for a method of improving localized wafer shape changes. This innovation describes a manufacturing technique involving the formation of trenches into the surface of a crystalline wafer, which extend along a <100> lattice direction. By utilizing this method, Chou's invention significantly reduces deformation in the wafer, minimizing stress when filling the trenches with a spin-on dielectric material. This process effectively resolves overlay issues caused by changes in wafer shape, enhancing the overall manufacturing quality.

Career Highlights: Chou is currently employed at Macronix International Co., Ltd., a leading company in the semiconductor industry. His work focuses on innovative approaches in the development and production of integrated circuits, making a marked impact in efficiency and performance within the sector.

Collaborations: Throughout his career, Fu-Hsing Chou has collaborated with esteemed coworkers such as Chi-Pin Lu and Pei-Ci Jhang. Working alongside these professionals has fostered an environment of creativity and innovation, furthering advancements in semiconductor technology.

Conclusion: Fu-Hsing Chou's groundbreaking patent and contributions to the field of integrated circuit manufacturing exemplify his dedication to driving innovation in technology. His work not only addresses immediate challenges in the industry but also sets a foundation for future advancements. As he continues to collaborate with fellow inventors, the potential for further innovations in this domain remains promising.

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