Munich, Germany

Friedrich Wanninger

This inventor holds 2 USPTO granted patents. Top assignee: Infineon Technologies Ag. Active years: 2002-2007.


% Patents Active = 50.0

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 5(Granted Patents)


Location History:

  • Würzburg, DE (2002)
  • München, DE (2007)

Company Filing History:


Years Active: 2002-2007

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2 patents (USPTO):Explore Patents

Title: Friedrich Wanninger: Innovator in Semiconductor Technology

Introduction

Friedrich Wanninger is a notable inventor based in Munich, Germany. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to electronic device design.

Latest Patents

Wanninger's latest patents include an encasing arrangement for a semiconductor component and an electronic device featuring a multiplicity of contact bumps. The first patent describes a semiconductor component package configuration that enhances the capability of conducting lost power dissipated from the installed semiconductor chip. This design incorporates a substrate for routing wiring terminals and a filler that mechanically isolates the semiconductor chip from solder joints. The second patent focuses on an electronic device that connects contact bumps to a semiconductor chip via flat conductors, ensuring efficient bonding and functionality.

Career Highlights

Friedrich Wanninger has established himself as a key figure in the semiconductor industry through his work at Infineon Technologies AG. His innovative designs have contributed to advancements in electronic devices, making them more efficient and reliable.

Collaborations

Wanninger has collaborated with talented coworkers such as Christian Hauser and Simon Muff, further enhancing the innovative environment at Infineon Technologies AG.

Conclusion

Friedrich Wanninger's contributions to semiconductor technology reflect his dedication to innovation and excellence in the field. His patents demonstrate a commitment to improving electronic device performance and reliability.

Profile summary based on public USPTO records.
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