Frieder Hainrich Baumann

Title: Frieder Hainrich Baumann: Innovator in Semiconductor Technology

Introduction

Frieder Hainrich Baumann is a notable inventor based in Hopewell Junction, NY (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of copper interconnects.

Latest Patents

Baumann holds a patent for a "Copper interconnect with CVD liner and metallic cap." This innovative structure features a diffusion barrier positioned adjacent to a sidewall and a bottom of an opening etched in a layer of dielectric material. The design includes a metal liner directly on top of the diffusion barrier, a seed layer made from copper material positioned directly on top of the metal liner, and a copper material placed directly on top of the seed layer. Additionally, a metallic cap is positioned directly on top of and selective to the copper material, with a capping layer adjacent to the metallic cap.

Career Highlights

Throughout his career, Baumann has worked with prominent companies in the technology sector, including IBM and STMicroelectronics GmbH. His experience in these organizations has allowed him to develop and refine his expertise in semiconductor innovations.

Collaborations

Baumann has collaborated with esteemed colleagues such as Chao-Kun Hu and Andrew Herbert Simon, contributing to advancements in semiconductor technology.

Conclusion

Frieder Hainrich Baumann's work in semiconductor technology, particularly his patented innovations, showcases his significant impact on the industry. His collaborations and career highlights further emphasize his role as a key figure in advancing technology.