Fred Percy Debnam, Ii

Title: Fred Percy Debnam, II: Innovator in Integrated Circuit Technology

Introduction

Fred Percy Debnam, II is a notable inventor based in Garland, TX (US). He has made significant contributions to the field of integrated circuit technology, particularly in the area of capacitor contact methods.

Latest Patents

Fred Percy Debnam, II holds a patent for a method titled "Capacitor contact formed concurrently with bond pad metallization." This innovative approach allows for the passivation and contacting of a capacitor in an integrated circuit (IC) above the top level of interconnect metallization, without the need for additional process steps. The method involves using a dielectric layer, part of the IC protective overcoat, which is deposited directly on the capacitor, overlapping the electrode edges. Contact to the top electrode of the capacitor is achieved by etching small capacitor vias during the bond pad via etch process. This is followed by depositing and patterning bond pad metal in the capacitor vias to connect the top electrode to other circuit elements in the IC. The top electrode thickness is increased to accommodate the bond pad via etch process. He has 1 patent to his name.

Career Highlights

Fred Percy Debnam, II is associated with Texas Instruments Corporation, a leading company in semiconductor design and manufacturing. His work has contributed to advancements in IC technology, enhancing the efficiency and functionality of electronic devices.

Collaborations

Throughout his career, Fred has collaborated with talented individuals such as Maxwell Walthour Lippitt, III and Stephen Arlon Meisner. These collaborations have fostered innovation and development in their respective fields.

Conclusion

Fred Percy Debnam, II is a distinguished inventor whose work in integrated circuit technology has made a lasting impact. His innovative methods continue to influence the design and functionality of modern electronic devices.