Frank Lei Ding

Title: The Innovative Contributions of Frank Lei Ding

Introduction

Frank Lei Ding is a notable inventor based in Milpitas, California, with a remarkable portfolio of six patents. His work primarily focuses on advancements in chip technology and optical systems, showcasing his expertise in the field of electronics and engineering.

Latest Patents

Among his latest patents, one significant invention is the "Chip on Carrier." This chip design features a first substantially planar isolation layer, a conduction layer, and a second isolation layer, all meticulously arranged to enhance functionality. The design includes a second conduction layer with an anode trace, a cathode trace, and an optical transmitter, facilitating efficient electrical coupling through vias. Another noteworthy patent is the "Horizontal Flex Circuit with Resistance Weldable Cover." This invention comprises multiple walls and supports, creating an interior cavity that allows for the transmission of optical signals, demonstrating innovative approaches to optical signal management.

Career Highlights

Frank has made significant contributions during his tenure at prominent companies such as Finisar Corporation and II-VI Delaware, Inc. His work in these organizations has been instrumental in developing cutting-edge technologies that push the boundaries of current electronic systems.

Collaborations

Throughout his career, Frank has collaborated with talented individuals, including Maziar Amirkiai and Tao Wu. These partnerships have fostered a creative environment that has led to the successful development of innovative technologies.

Conclusion

Frank Lei Ding's contributions to the field of electronics and his impressive patent portfolio highlight his role as a leading inventor. His innovative designs and collaborative efforts continue to influence advancements in technology.