Company Filing History:
Years Active: 2011-2025
Title: Frank Küchenmeister: Innovator in Electrical Interconnections
Introduction
Frank Küchenmeister is a notable inventor based in Dresden, Germany. He has made significant contributions to the field of electrical interconnections, holding a total of 2 patents. His work focuses on innovative structures and methods that enhance the functionality and reliability of semiconductor devices.
Latest Patents
Küchenmeister's latest patents include "Acentric non-round electrical interconnections" and "Semiconductor devices having stress relief layers and methods for fabricating the same." The first patent describes a structure for an electrical interconnection that features a bond pad and a pillar with a non-round closed shape, positioned acentric relative to the first section. This design aims to improve the performance of electrical connections. The second patent outlines methods for fabricating semiconductor devices, which involve creating a stress-relief layer and an interconnecting structure that enhances the device's reliability.
Career Highlights
Throughout his career, Küchenmeister has worked with prominent companies such as GlobalFoundries Inc. and GlobalFoundries U.S. Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.
Collaborations
Küchenmeister has collaborated with notable colleagues, including Michael Zhouying Su and Lei Fu. These partnerships have contributed to the advancement of his research and the successful development of his patents.
Conclusion
Frank Küchenmeister is a distinguished inventor whose work in electrical interconnections and semiconductor devices has made a significant impact in the field. His innovative patents and collaborations reflect his commitment to advancing technology and improving device performance.