Globalfoundries Inc.

Globalfoundries U.S. Inc.

Frank Küchenmeister

Michael Zhouying Su

Lei Fu

Kashi Vishwanath Machani

Structures for an electrical interconnection and methods of forming a structure for an electrical interconnection. The structure comprises a bond pad and an electrical interconnection including a pillar positioned on a portion of the bond pad. The pillar includes a first section and a second section between the first section and the portion of the bond pad. The second section has a cross section with a perimeter having a non-round closed shape, and the second section is positioned acentric relative to the first section.

Acentric non-round electrical interconnections

Methods are provided for fabricating a semiconductor device. In accordance with an exemplary embodiment, a method comprises the steps of providing a semiconductor die having a conductive terminal, forming an insulating layer overlying the semiconductor die, and forming a cavity in the insulating layer which exposes the conductive terminal. The method also comprises forming a first stress-relief layer in the cavity, forming an interconnecting structure having a first end electrically coupled to the first stress-relief layer, and having a second end, and electrically and physically coupling the second end of the interconnecting structure to a packaging substrate.

Growing community of inventors

Dresden, Germany

Frank Küchenmeister