Far Hills, NJ, United States of America

Frank J Semcer, Sr

This inventor holds 1 USPTO granted patent. Top assignee: Micro Stamping Corporation. Active years: 2014.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Frank J Semcer, Sr: Innovator in Lead Frame Technology

Introduction

Frank J Semcer, Sr. is a notable inventor based in Far Hills, NJ (US). He has made significant contributions to the field of capacitor technology, particularly through his innovative patent related to lead frames.

Latest Patents

Frank J Semcer, Sr. holds a patent for lead frames for capacitors. This invention involves a ferritic stainless steel, non-ferritic stainless steel, or carbon steel-based lead frame and a method for producing it. The lead frame is primarily designed for Tantalum-Niobium capacitors but may also be applicable to other integrated circuits with similar operating parameters. The preparation of the lead frame includes selecting a base metal, rolling it to the required thickness, and applying a nickel strike or other conventional barrier layer, followed by final outer plating layers. The specific thickness and layering can be customized to meet the requirements of each lead attach process.

Career Highlights

Frank J Semcer, Sr. is associated with Micro Stamping Corporation, where he has utilized his expertise in developing advanced lead frame technologies. His work has contributed to the enhancement of capacitor performance and reliability.

Collaborations

Throughout his career, Frank has collaborated with notable colleagues, including Frank J Jankoski, Jr. and Steven G Santoro. These collaborations have fostered innovation and development in their respective fields.

Conclusion

Frank J Semcer, Sr. is a distinguished inventor whose work in lead frame technology has made a significant impact on the capacitor industry. His innovative approach continues to influence advancements in electronic components.

Profile summary based on public USPTO records.
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